The emitter or p-n junction is the core of crystalline silicon solar cells. The vast majority of silicon cells are produced using a simple process of high temperature diffusion of dopants into the crystal lattice. This paper takes a closer look at the characteristics of this diffusion and possible variations in the process, and asks whether this step can lead to optimal emitters or whether emitters should be made with different processes in order to obtain the highest possible efficiency.
Development of fine-line crystalline silicon solar cells is a potential direction for application of high-efficiency and low-cost solar cells in the industry. Fine-line mask-free metallization offers a great potential to increase cell efficiency by reducing metal shadowing losses and surface recombination losses. At China Sunergy, three promising approaches for fine-line crystalline silicon solar cells are currently undergoing research, including processes such as laser doping selective emitter (LDSE) technology, inkjet or aerosol jet printing of metal paste and upgraded screen-printing technology. This paper presents the basic investigations of these three manufacturing technologies, singling out the technology that presents the most potential for further application.
This paper, the second in a series covering cost of ownership studies for photovoltaics [1], examines the need for saw damage removal and the follow-on processes of precleaning, texturization, and cleaning. The process considerations for wet and plasma approaches are further discussed before taking a detailed look at texturization using random pyramid formation. The paper will conclude with a view of current and future wet process techniques and a cost of ownership case study using Akrion Systems’ GAMA-Solar as an example.
In today’s market, crystalline silicon wafer technology dominates industrial solar cell production. Common devices feature opposing electrodes that are situated at the front and rear surface of the wafer and subsequent front-to-rear interconnection is used for module assembly. This paper reflects the functions which have to be fulfilled for the back-side contact of the solar cell as well as challenges and advances for the two basic classes: full-area and local rear contact formation. While full-area contacting has proven to be a reliable technology for industrial production, local contacting through dielectric layers has yet to be put through its paces in industrial implementation.
The PV industry is expected to eventually reduce its manufacturing costs well below €1/Wp. Major technological changes lie ahead of us for manufacturing wafers, solar cells and modules if this cost target is to be met. In order to focus R&D efforts amongst the myriad options, and to speed up the learning curve, the PV industry (equipment vendors, material suppliers and PV manufacturers) may benefit from collaborative efforts guided by an ITRS-like roadmap. In this paper we present the IMEC roadmap, the target of which is to reduce drastically the amount of pure Si needed per Wp by combining efficiencies beyond 20% with aggressive reductions in wafer thicknesses.
Despite the fall in silicon prices, wafer thickness continues to be reduced. The handling of thin wafers between 120 and 160µm is under research at the Fraunhofer IPA, where gripper-dependent and independent variables were determined as parameters for the handling process. Diverse grippers are tested on an automated test platform. Among these are grippers that are specifically designed for wafer handling, as well as others that are not but are used for wafer manipulation. The test platform includes several different test and handling equipments and utilizes critical parameters that might be required for achieving a high production rate via shortest cycle times to investigate the impact on thin wafers. The first results of the position accuracy measurement in relation to the physical movement parameters and other industrial key figures in ongoing handling research are presented within this paper.
The key to delivering highly efficient solar cells is to absorb as much light as possible from the solar spectrum and convert it effectively into electrical energy. Anti-reflective coatings have served as agents for reducing reflective losses and improving bulk and surface passivation thus enhancing both of the parameters – short circuit current and open circuit voltage of a solar cell. Simulation studies show that an SiN/MgF dual-layer anti-reflective coating is best for a bare cell. This paper takes a closer look at how this coating can reduce the reflectance for a broad range of wavelengths and thus enhance the quantum efficiency of the cell in the blue and red region of the solar spectrum.
Photovoltaic modules are designed to meet the reliability and safety requirements of national and international test standards. Qualification testing is a short-duration (typically, 60-90 days) accelerated testing protocol, and it may be considered as a minimum requirement to undertake reliability testing. The goal of qualification testing is to identify the initial short-term reliability issues in the field, while the qualification testing/certification is primarily driven by marketplace requirements. Safety testing, however, is a regulatory requirement where the modules are assessed for the prevention of electrical shock, fire hazards, and personal injury due to electrical, mechanical, and environmental stresses in the field. This paper examines recent reliability and safety studies conducted at TÜV Rheinland PTL’s solar module testing facility in Arizona.
Standard solar cell technology nowadays offers a variety of measures - some linked, some not - to continuously improve conversion efficiency. The starting point for considering the different improvement steps is a kind of standard cell as produced on most current production lines. The main elements of this cell are diffused junction, aluminium back-surface field and screen-print metallization. This type of cell suffers losses from different sources like optics, recombination and resistance that can be considerably lowered to obtain higher cell efficiency. This paper will describe improvement steps on the standard type of multi-crystalline cell before addressing cell concepts that open further potential.
One-step screen-printing processes are still the most widely-used technique for the front-side metallization of crystalline silicon solar cells in the PV industry. This is because of the knowledge, stability and speed of the process, and despite some big disadvantages exhibited by the resulting contacts. Therefore, the metal contacts of high-efficiency laboratory cells are usually produced via advanced two-step metallization processes, which allow the application of optimized contact structures. In a first step, a narrow metal layer is applied to form the contact to the silicon wafer. Several different techniques have been developed for this first stage. In the second step, the seed layer is reinforced electrochemically with a dense layer of a metal of high conductivity, usually by light-induced plating. The transfer of such techniques into industrial scale has been pursued intensively, and may enter solar cell production lines in the near future. However, the process can still be improved based on a better process understanding, in order to benefit from the full potential of the technology.